Copper has one third the resistivity of Aluminum and can be electrodeposited easily. Hence, Copper can be used for chip wiring. This Nanofablicaton technology is used to electrodeposit Copper into the fine cavities or vias of diameters less than 0.1¿m, and lengths 1/1000 of the diameter of human hair. Since then the Copper Damascene on chip semiconductor wiring process has spread out to semiconductor industries all over the world and branched into four major industrial applications: Damascene, through silicon via, interstitial via hole build-up printed wiring boards and Copper foil that is smooth on both sides. However, no comprehensive books have been published in this area of acceleration in Copper bottom up filling. The present book starts from a fundamental review of Copper electrodeposition. The book covers five topics on the key to acceleration in Copper bottom up filling. Role of additives in Copper bottom up filling. Review on acceleration effect, basic items to understand the cuprous acceleration effect, mechanism of cuprous acceleration and application of cuprous acceleration applied to Through Silicon Via(TSV). We really hope that this book will give some help.