The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

TECHNOLOGIESA. Adhesive and Anodic BondingGlass Frit Wafer BondingWafer Bonding Using Spin-On Glass as Bonding MaterialPolymer Adhesive Wafer BondingAnodic BondingB. Direct Wafer BondingDirect Wafer BondingPlasma-Activated BondingC. Metal BondingAu/Sn SolderEutectic Au-In BondingThermocompression Cu-Cu Bonding of Blanket and Patterned WafersWafer-Level Solid-Liquid Interdiffusion BondingD. Hybrid Metal/Dielectric BondingHybrid Metal/Polymer Wafer Bonding PlatformCu/SiO2 Hybrid BondingMetal/Silicon Oxide Hybrid BondingAPPLICATIONSMicroelectromechanical SystemsThree-Dimensional IntegrationTemporary Bonding for Enabling Three-Dimensional Integration and PackagingTemporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated SystemsThin Wafer Support System for above 250°C Processing and Cold De-bondingTemporary Bonding: Electrostatic