This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

Chapter1. Introduction to RF and Microwave Microelectronic Packaging.- Chapter2. Packaging of Transmit/Receive Modules.- Chapter3. 3D Transitions and Connections.- Chapter4. Electromagnetic Shielding for RF & Microwave Packages.- Chapter5. Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate.- Chapter6. Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package.- Chapter7. Chip Size Packaging (CSP) for RF MEMS Devices.- Chapter8. The challenge in packaging and assembly the advanced power amplifiers.- Chapter9. High Thermal Conductivity Materials - Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond.- Chapter10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging.- Chapter11. Carbon nanotubes and graphene for microwave/RF electronics packaging.