This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits.

Interconnect challenges for 2D and 3D Integration.- Overview of Carbon Nanotube Physical Properties.- Overview of Carbon Nanotube Processing Methods.- Electrical Conductivity of Carbon Nanotubes - Modeling and Characterization.- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material.- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects.- Carbon Nanotubes as Vertical Interconnects for 3D ICs.- Carbon Nanotubes as Micro-Bumps for 3D Integration.- Electrothermal Modeling of Carbon Nanotubes TSVs.- Exploring Carbon Nanotubes for 3D Power Delivery Networks.- Carbon Nanotubes for Monolithic 3D ICs.