This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: ¿ ULSI wiring material based upon copper nanowiring ¿ Printed circuit boards ¿ Stacked semiconductors ¿ Through Silicon Via ¿ Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

Focuses on wide range of microelectronics application

Preface (Kazuo Kondo)PART 1 Copper electrodepositon and additive chemistryChapter 1 - Copper electrodeposition (Masayuki Yokoi)Chapter 2 - Suppression effect and Additive Chemistry (Masayuki Yokoi)Chapter 3- Acceleration effect (Dale P. Barkey)Chapter 4- Modeling and Simulation ( Yutaka Kaneko)PART 2 Copper on chip metallizationChapter 5- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects (James R. Rohan)Chapter 6- Microstructure of Evolution of Copper in Nano-scale Interconnect Features (James Kelly, Christopher Parks, James Demarest, and Christopher Penny)Chapter 7- Direct Copper Plating (Aleksandar Radisic and Philippe M. Vereecken)Part 3 ¿ Through Silicon Via and Other MethodsChapter 8- Through Silicon Via (Kazuo Kondo)Chapter 9- Build-up Printed Wiring board (Kiyoshi Takagi a and Toshkazu Okubo)Chapter 10- Copper Foil Smooth on Both Sides for Lithium Ion Battery (Akitoshi Suzuki and Jun Shinozaki)Chapter 11- Through hole plating (Wei-Ping Dow)