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Copper Electrodeposition for Nanofabrication of Electronics Devices
ISBN-13:
9781461491767
Veröffentl:
2013
Seiten:
282
Autor:
Kazuo Kondo
Serie:
171, Nanostructure Science and Technology
eBook Typ:
PDF
eBook Format:
EPUB
Kopierschutz:
1 - PDF Watermark
Sprache:
Englisch
Beschreibung:
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as:
Copper Electrodeposition.- Suppression Effect and Additive Chemistry.- Acceleration Effect.- Modeling and Simulation.- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects.- Microstructure of Evolution of Copper in Nano-scale Interconnect Features.- Direct Copper Plating.- Through Silicon Via.- Build-up Printed Wiring Boards.- Copper Foil Smooth on Both Sides for Lithium Ion Battery.- Through Hole Plating.
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