Copper Electrodeposition for Nanofabrication of Electronics Devices
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ISBN-13:
9781461491750
Veröffentl:
2013
Einband:
HC runder Rücken kaschiert
Erscheinungsdatum:
21.11.2013
Seiten:
292
Autor:
Kazuo Kondo
Gewicht:
606 g
Format:
241x160x22 mm
Serie:
Nanostructure Science and Technology
Sprache:
Englisch
Beschreibung:
This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: ¿ ULSI wiring material based upon copper nanowiring ¿ Printed circuit boards ¿ Stacked semiconductors ¿ Through Silicon Via ¿ Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.
Focuses on wide range of microelectronics application
Copper Electrodeposition.- Suppression Effect and Additive Chemistry.- Acceleration Effect.- Modeling and Simulation.- Frontiers of Cu Electrodeposition and Electroless Plating for On-Chip Interconnects.- Microstructure of Evolution of Copper in Nano-scale Interconnect Features.- Direct Copper Plating.- Through Silicon Via.- Build-up Printed Wiring Boards.- Copper Foil Smooth on Both Sides for Lithium Ion Battery.- Through Hole Plating.
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