Simulated Annealing for VLSI Design

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1. Introduction.- 1.1. Combinatorial Optimization.- 1.2. The Method of Simulated Annealing.- 1.3. Remarks.- 2. Placement.- 2.1. Introduction.- 2.2. Gate-Array Placement.- 2.2.1. The K-G-V Algorithm.- 2.2.2. TimberWolf.- 2.3. Standard-Cell Placement.- 2.3.1. TimberWolf.- 2.3.2. Another Approach.- 2.4. Macro/Custom-Cell Placement.- 2.4.1. Jespen and Gelatt's Algorithm.- 2.4.2. TimberWolf.- 2.5. Other Stochastic Algorithms.- 2.5.1. Genetic Placement.- 2.5.2. Simulated Evolution Placement.- 2.6. Concluding Remarks.- 3. Floorplan Design.- 3.1. Introduction.- 3.2. Part 1: Rectangular Modules.- 3.2.1. Slicing Floorplans.- 3.2.2. Solution Space.- 3.2.3. Neighboring Solutions.- 3.2.4. Cost Function.- 3.2.5. Annealing Schedule.- 3.2.6. Experimental Results.- 3.3. Part 2: Rectangular and L-Shaped Modules.- 3.3.1. Geometric Figures.- 3.3.2. The Operators.- 3.3.3. Floorplan Representation.- 3.3.4. The Algorithm.- 3.3.5. Experimental Results.- 3.4. Concluding Remarks.- 4. Channel Routing.- 4.1. Introduction.- 4.2. The Channel Routing Problem.- 4.3. The Channel Router SACR.- 4.3.1. Solution Space.- 4.3.2. Neighboring Solutions.- 4.3.3. Cost Function.- 4.3.4. Annealing Schedule.- 4.3.5. Fast Approximation Scheme.- 4.4. The Channel Router SACR2.- 4.5. Experimental Results and Discussion.- 4.6. Concluding Remarks.- 5. Permutation Channel Routing.- 5.1. Introduction.- 5.2. Motivation and Applications.- 5.3. NP-Completeness Results.- 5.4. First Method - Simulated Annealing.- 5.4.1. Neighboring Solutions.- 5.4.2. Cost Function.- 5.4.3. Annealing Schedule.- 5.5. Second Method - Iterative Improvement.- 5.5.1. The Iterative Improvement Scheme.- 5.5.2. Version-D.- 5.5.3. Version-C.- 5.5.4. Choice of Initial Solution.- 5.6. Experimental Results.- 5.7. Concluding Remarks.- 6. PLA Folding.- 6.1. Introduction.- 6.2. The PLA Folding Problem.- 6.3. The PLA Folding Algorithm.- 6.3.1. Solution Space.- 6.3.2. Neighboring Solutions.- 6.3.3. Cost Function.- 6.3.4. Annealing Schedule.- 6.4. Multiple-Folded PLA Realization.- 6.5. Constrained Multiple Folding.- 6.6. Simple Folding.- 6.7. Experimental Results and Discussions.- 6.8. Concluding Remarks.- 7. Gate Matrix Layout.- 7.1. Introduction.- 7.2. Problem Formulation.- 7.3. Generalized Problem Formulation.- 7.4. Advantages of the Generalized Formulation.- 7.5. The Simulated Annealing Method.- 7.5.1. Solution Space.- 7.5.2. Neighboring Solutions.- 7.5.3. Cost Function.- 7.5.4. Annealing Schedule.- 7.6. Experimental Results.- 7.7. Concluding Remarks.- 8. Array Optimization.- 8.1. Introduction.- 8.2. The Array Optimization Problem.- 8.3. Definitions.- 8.4. The Array Optimization Algorithm.- 8.4.1. The Algorithm Column-Fold.- 8.4.2. The Algorithm Row-Fold.- 8.4.3. The Solution Space.- 8.4.4. The Main Folding Algorithm.- 8.5. Experimental Results.- 8.6. Concluding Remarks.- References.
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This monograph represents a summary of our work in the last two years in applying the method of simulated annealing to the solution of problems that arise in the physical design of VLSI circuits. Our study is experimental in nature, in that we are con­ cerned with issues such as solution representations, neighborhood structures, cost functions, approximation schemes, and so on, in order to obtain good design results in a reasonable amount of com­ putation time. We hope that our experiences with the techniques we employed, some of which indeed bear certain similarities for different problems, could be useful as hints and guides for other researchers in applying the method to the solution of other prob­ lems. Work reported in this monograph was partially supported by the National Science Foundation under grant MIP 87-03273, by the Semiconductor Research Corporation under contract 87-DP- 109, by a grant from the General Electric Company, and by a grant from the Sandia Laboratories.

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Autor: H. W. Leong
ISBN-13 :: 9781461289470
ISBN: 1461289475
Erscheinungsjahr: 05.10.2011
Verlag: Springer US
Gewicht: 339g
Seiten: 220
Sprache: Englisch
Auflage Softcover reprint of the original 1st ed. 1988
Sonstiges: Taschenbuch, 235x155x12 mm
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