Electronic Packaging of High Speed Circuitry
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ISBN-13:
9780070359703
Veröffentl:
1997
Erscheinungsdatum:
01.05.1997
Seiten:
445
Autor:
Stephen G Konsowski
Gewicht:
798 g
Format:
235x160x37 mm
Sprache:
Englisch
Beschreibung:
With the help of this expert guide, you can design and package the high-frequency circuitry crucial to the performance of todayÕs advanced electronic products, such as Pentium chips, HDTV, and mobile communications. This book fully explains approaches that include basic signal transmission theory, digital and microwave circuit design, and how these are integrated with the packaging and interconnection characteristics. YouÕll find detailed coverage of signal behavior in both high speed digital and microwave circuits, as well as crucial aspects of materials selection and manufacturing.
High Speed Digital and Microwave Packaging.Fundamentals of Electricity and Magnetism Applied to Electromagnetics.Packaging Technologies for High Speed Digital and Microwave Circuits.Practical Design Details for Microwave Circuit Packaging.Microwave Circuit Assembly and Development.Transmission Lines: Effects and Analysis.Ideal Transmission Lines.Transmission-Line Interconnections: Load and Ends.Signal Reflections, Bandwidth, and Losses.Transmission Lines: Reflection Diagrams.Transmission Lines: Signal Levels.Interconnections: Routing to Critical Signals.ECL Transmission Lines and Terminations.Differential Line Drivers and Terminations.
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