Advances in technology are making the business and manufacturing environment increasingly complex. Standards can help us cope with this complexity. Given the strategic importance of computers in the economies of the industrial world, it is fitting that one of the most significant commercial stories of our time is the standardization of computer communications. Quite frankly, when we joined with other computer users to launch this effort we didn't predict its scope and we should have done. public visibility. In restrospect, I guess The computer assisted technologies looming on the horizon offer some of the greatest functional and productivity tools available to improve business operations. However, the absence of a standardized electronic link permeating most business organizations poses a severe impediment to the efficient deployment of this technology. The feasibility of using computer controlled devices to design, test, and manufacture products - as part of a massive network - is well within our technological grasp. However, unless the world agrees upon a global set of standards that will make multi-vendor computer systems interoperable, successful implementation of these technologies becomes less and less attractive.

1 Introduction.- 2 Current Manufacturing Techniques.- 3 The Network - The Physical Transmission Medium.- 3.1 Basic communications.- 3.2 Communications options.- 3.2.1 Twisted pair.- 3.2.2 Common connecting methods.- 3.2.3 Other twisted-pair systems.- 3.3 Distributed LANs.- 3.3.1 Fibre optics.- 3.3.2 Ethernet.- 3.3.3 Token passing.- 3.3.4 Broadband and baseband.- 3.4 Head ends.- 4 The Seven Layer Model.- 4.1 The application itself.- 4.2 Applications layer (layer 7).- 4.2.1 ACSE, formerly called CASE.- 4.2.2 FTAM.- 4.2.3 MMFS and MMS.- 4.2.4 Other SASE elements.- 4.3 Presentation layer (layer 6).- 4.4 Session layer (layer 5).- 4.5 Transport layer (layer 4).- 4.5.1 Connection-oriented and connectionless communications.- 4.5.2 Error correction.- 4.6 Network layer (layer 3).- 4.7 Datalink layer (layer 2).- 4.8 Physical layer (layer 1).- 4.8.1 Frame lengths.- 4.8.2 Carrier band.- 4.8.3 Enhanced Performance Architecture (EPA).- 4.8.4 Why bother with broadband?.- 4.8.5 Field bus.- 4.9 Interconnecting MAP and TOP with each other and with other systems.- 4.10 Technical and Office Protocols (TOP).- 5 The Standards Scene.- 5.1 The origins of OSI.- 5.2 The International Standards Organization (ISO).- 5.3 ISO stages of development of standards.- 5.4 National activity in the UK.- 5.5 Who's who in standards.- 6 Key Issues.- 6.1 The functionality of MMS.- 6.1.1 CNMA's concerns.- 6.1.2 Migration.- 6.1.3 Companion standards.- 6.1.4 Ambiguities.- 6.2 Interoperability.- 6.3 Testing.- 7 Map and Top Application Case Studies.- 7.1 The Towers of Hanoi and beyond.- 7.1.1 Autofact 1985.- 7.1.2 Lessons learnt.- 7.1.3 The way ahead.- 7.2 Cell controller applications.- 7.2.1 Application 1.- 7.2.2 Application 2.- 7.3 A link from design to assembly and inspection.- 7.4 MAP in the electronics test environment.- 7.5 AIMS - an Assembly Information Management System applied to engine assembly.- 7.5.1 The solution.- 7.5.2 Autonomous operation.- 7.5.3 Real-time response.- 7.5.4 Standardization.- 7.5.5 The future.- 7.6 Using MAP in the factory.- 7.6.1 MAP implementation.- 7.6.2 MAP network access methods.- 7.6.3 Data flow and message traffic.- 7.6.4 MMFS Robot Class 2 - typical messages.- 7.7 MAP in printed circuit board assembly.- 7.8 Communications in the aerospace industry.- 7.9 MAP in General Motors.- 7.9.1 Saginaw.- 7.9.2 The GMT400 Truck and Bus Project.- 8 The Way Ahead.- 8.1 The future.- 8.2 MAP and TOP products.- Useful Addresses.- Abbreviations.- Sources and Recommendations for Further Reading.