Beschreibung:
This book presents an overview of the field of 3D IC design, with an
Contains a thorough survey of the field for 3D EDA tools
3D Process Technology Considerations.- Thermal and Power Delivery Challenges in 3D ICs.- Thermal-Aware 3D Floorplan.- Thermal-Aware 3D Placement.- Thermal Via Insertion and Thermally Aware Routing in 3D ICs.- Three-Dimensional Microprocessor Design.- Three-Dimensional Network-on-Chip Architecture.- PicoServer: Using 3D Stacking Technology to Build Energy Efficient Servers.- System-Level 3D IC Cost Analysis and Design Exploration.